Explore our industrial fluid, circular electrical, and high-density rectangular board-level connectors engineered for critical missions.
Dynalink Electronic Technology Co., Ltd (DL), established in 2007, currently has a workforce of over 800 employees, among which more than 200 are technical staff. It is a technology-driven design and manufacturing company specializing in power supplies, energy storage capacitors, and connectors.
With continuous investment in research and development and strong innovation capabilities, the company has built a complete industrial chain encompassing material research and development, product design, and precision manufacturing. Thanks to the advantages of high reliability and excellent performance, its products are widely used in key fields such as aviation, aerospace, shipping, railways, new energy vehicles, the medical industry, drones, and robots, providing customized solutions for customers.
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Our comprehensive customized development system provides full-cycle support, ensuring extreme reliability in hazardous and demanding environments.
In UAV, unmanned systems, and aviation platforms, our circular electrical connectors ensure stable power delivery and low-loss high-speed signal pathways during high-vibration flights. They optimize battery charging cycles, prevent signal jitter, and maintain structural integrity under extreme G-force loads.
For modern data centers, our high-speed board-to-board connectors (0.50mm and 0.80mm pitch) guarantee low crosstalk and minimal signal attenuation. Engineered for high-frequency signal pathways, they support high bandwidth data transfer requirements, preventing transmission bottlenecks in mainframe systems.
Under complex manufacturing layouts, our bayonet-locking and blind-mate fluid connectors provide robust protection. Designed with IP67/IP68 ingress sealing and vibration-resistant mechanisms, they offer leak-free connections for hydraulic, pneumatic, and liquid-cooling pathways in CNC machinery and robotic arms.
Staying at the forefront of interconnect design requires a balance of materials science, high-precision machining, and high-frequency wave physics.
Minimizing space on PCBs is critical for aerospace avionics. Our 80X and 80BX series manage pitch densities down to 0.50mm while utilizing custom liquid crystal polymer (LCP) insulators to maintain insulating resistance above 1000MΩ under moisture exposure.
Modern high-performance computing (HPC) and military electronics rely on liquid cooling. Our technology merges fluid couplings (blind-mate YTF series) and power terminals into unified structures, offering auto-coupling capabilities without liquid-spill hazards.
To resist salt spray and corrosive chemicals, we employ multi-layer electroplating processes, applying thin nickel underplates with heavy gold overlays. This preserves contact resistance within single-digit milliohms even after 500+ mating cycles.
As industrial demands transition toward higher automation, DL is actively researching advanced smart interconnects. Our R&D division is integrating RFID chips and micro-sensors within circular connectors to monitor contact wear, pin-temperature spikes, and lock-state dynamics. These diagnostic tools aim to shift routine maintenance toward predictive models in aerospace and critical rail transit systems.
Taking quality as our shield, we continuously optimize processes and standards to forge industry benchmark products. Focused on the fields of batteries, capacitors, and connectors, we use innovation as our spear, making every effort to overcome technical bottlenecks.
Every product undergoes electrical, mechanical, and environmental testing. Our certifications reflect our commitment to excellence.
Detailed insights from our senior application engineers on connector selection, mechanical ratings, and electrical performance parameters.
The 599 series follows military standard design structures, featuring differences in coupling styles and contact configurations. Series I features standard bayonet coupling for rapid lock-on applications. Series II reduces profile height for tight spaces where weight is critical. Series III incorporates high-performance triple-start threaded coupling with anti-decoupling detents, ensuring contact integrity in severe vibration environments up to 200°C.
Our fluid connector series (YTA, YTB, YTC, and YTF) utilize high-resilience elastomeric seals (FKM or HNBR) coupled with precision-machined internal bypass valves. This double-barrier design prevents fluid egress during blind-mate docking. The internal valves open only after the mechanical coupling has established a tight seal, shielding electronics from potential contamination.
The 80X and 80BX series are engineered to optimize signal integrity. By routing differential pairs through shielding paths, they support data rates up to 28 Gbps per lane, making them compatible with PCI Express Gen 4 and high-bandwidth Ethernet requirements in industrial control servers.
We operate a self-developed intelligent design platform. Our engineers can convert specifications into custom 3D models and finite element analysis (FEA) reports within 48 hours. Our in-house prototyping facility delivers physical samples for testing in weeks rather than months, speeding up the product development process.
Explore our fluid locking options, high-density plug-and-socket configurations, and blind-mate integration units.
Dynalink Electronic
